CATEGORIES

Reversible interpenetrating polymer network

Description:

Inventors: Scott Compel, Andrea Wong, and Chris Ackerson

Patent status: US and PCT applications pending

 

Innovators at Colorado State University have developed a novel and highly modular reversible interpenetrating polymer network (IPN). When mixing specific compounds are mixed in water, hydrogen bonds form a 3D network between the polymers that results in a viscoelastic fluid.

The fluid can be molded to any desired shape, and subsequent drying of water causes the collapse of the crosslinking network to form an amorphous and transparent solid resin. This resin is self-healing in that addition of water reforms crosslinks in the IPN. The material is modular depending on the vitrification process and polymer composition. The pressure and temperature at which water is removed alters the properties of the solid resin by changing its final morphology. Products produced include thin films, foams of various porosity (cm-nm), powders, flowable inks, and gels, all of which allow for a variety of downstream applications. Variations in polymer length and shape change the viscoelastic behavior of the material, which can be fine tuned for any desired application.

 

Alterations in composition grant the material useful properties, such as electrical conductivity, fluorescence, and magnetism, depending on the application desired.


Key Advantages:

No other additive components necessary

Ability to exist in a variety of morphologies

 

Applications of the invention:

Agriculture: seed coatings, seed tape, water-soluble packaging

Electronics: batteries, fluorescent lamps, circuitry

Pharmaceutical: tablet binder, gel capsule coatings, controlled release matrix systems, bioadhesives

Misc: adhesives / cements, magnetic paint, protective coatings

Patent Information:

App Type Country Serial No. Patent No. File Date Issued Date Expire Date

Category(s):

For Information, Contact:

Steve Foster Director, Business Development
CSU Ventures, Inc.
steve.foster@colostate.edu

Inventors:

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