Apparatus and Method for Rapid Cooling of Large Area Substrates in Vacuum
This innovation facilitates rapid cooling in a vacuum (from 200 oC to 25 oC) and greatly diminishes the time required to produce complex thin films requiring multiple deposition steps.At a GlanceReduces cooling time of a substrate in vacuum from hours to just a few minutesDecreases device fabrication timeIncreases throughput rate and overall manufacturing...
Published: 11/8/2018
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Inventor(s): Kurt Barth, Robert Enzenroth, Walajabad Sampath
Keywords(s):
Category(s): Chemicals & Materials, Energy & Natural Resources, Electronic Devices & Instrumentation
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